Telefonica and huawei MoU

Telefonica, Huawei Sign MoU On Telco Cloud Cooperation

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Huawei signed MoU with Telefonica on Telco Cloud cooperation, which covers the UNICA Infrastructure, SDN network and NFV.

During the signing of the agreement, both the companies pledged to deepen bilateral cooperation in Telco cloud field and promoting commercial progress of cloud computing technology in Telefonica.

The MoU was jointly signed by Enrique Blanco Nadales, Chief Technology Officer (CTO) of the Telefonica group and Ken Hu, Rotating CEO and Deputy Chairman of the Board of Huawei.

Nadales remarked, “The UNICA Infrastructure, SDN network and NFV lay basis for implementing Telefonica network transformation and they play a significant role in simplifying the infrastructure architecture, improving efficiency and reducing costs.”

While, Hu said, “The UNICA Infrastructure is an open and future-proof strategic framework, it brings unique values to Telefonica: shorten time to market greatly through automatic service deployment, save cost for operation and maintenance through simplified architecture, achieve agile operation through unified global resource management and global governance.”

Huawei Distributed Cloud Data Center (DC²) and the SDN network solution seamlessly match Telefonica UNICA infrastructure architecture. With the efforts of both parties, a competitive next generation ICT infrastructure will be constructed, the Rotating CEO of Huawei added.

In August of 2012, a joint planning team was set up by Huawei and Telefonica and Huawei developed SoftCOM framework based Distributed Cloud Data Center and SDN solution with optimized carrier-class performance. The solutions were verified during the 2 phases of UNICA infrastructure PoC by the end of 2013.

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Wahengbam Rorrkychand

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